About the Conference Call for Papers Conference Program Registration

>Intent to Participate
>Submission of Tech Papers
>Info for Authors/Speakers
>VISA Information
>Patron Information
>General Information
>Hotel Information
>IEEE Travel Services
>CTIA Information

General Chair
Lothar Pauly
Siemens Communications, Germany
Executive Chair
Werner Mohr
Siemens Communications, Germany
TPC Chair
K.C. Chua
National Univ. of Singapore, Republic of Singapore
TPC Vice-Chair (Phy/MAC)
Sumit Roy
Univ. of Washington, USA
TPC Vice-Chair (Networks)
Victor Leung
Univ. of British Columbia, Canada
TPC Vice-Chair (Services & Applications)
Abbas Jamalipour
Univ. of Sydney, Australia
TPC Vice-Chair (Tutorials)
T.J. Lim
Univ. of Toronto, Canada
TPC Vice-Chair (Technology / Business Applications Panels)
Vijay Varma
Telcordia Technologies, USA
Publications Chair
Charles Knutson
Brigham Young Univ., USA
Associate TPC Vice Chair (Phy/MAC)
Uday Desai
IIT - Bombay, India
Project Manager
Debora Kingston
IEEE Communications Society, USA
Bruce Worthman
IEEE Communications Society, USA
WCNC Steering Committee Chair
J. Roberto B. de Marca
PUC/Rio, Brazil

Conference Program
WCNC 2005 Technology and Business Applications Panels

Thursday 17 March 2005
9:00 - 10:30 Room 208 - 210

P9: New Technologies, Open Standards, License-Free Spectrum; Who if Anybody is Going to Make Money in the Short Run and Who Benefits in the Long Run?

Chair: Thomas S. Huseby, Managing Partner, SeaPoint Ventures, USA

Abstract: Wi-Fi , WiMAX, VOIP magic standards on licensed-free spectrum and almost free network, but in the end what is the economic incentive for technical innovation? What business models can emerge to validate this investment? What other opportunities for technical innovation exist with real market demand and solid available business models? This panel of operators, investors, and analysts will explore the market drivers for technical innovation.

Julie Ask, Senior Analyst, Jupiter Research, USA
Philip Junker, SVP Strategic Applications, Alltel, USA
Eric Stonestrom, CEO of Airspan, USA
William J. Hoffman, CEO of VWN, USA

Back to Panels List